Printing electronics is a new and quickly growing alternative to traditionally manufactured electronics wherein an additive method is used to produce electronic circuits, passive circuitry, displays, sensors, utilizing conductive and sometimes dielectric materials. Advances have been made in electronic printing technology in recent years bringing it closer to scalable manufacturing. Flexible PCBs (FPCB) provide the same processing capability as a standard PCB, with added flexibility, and are better suited for space applications. FPCB’s are more reliable, can bend without breaking / sustaining damage, can withstand greater stress and harsher conditions, and can be adapted to smaller spaces due to thin copper and insulating layers.
ChemCubed (C3) provides additively manufactured (AM) printing solutions for electronics. One of the key advances in recent years in AM electronics has been in the conductive inks for inkjet printing. This advance is a main reason why scalable printed manufacture PCBs is now within reach. C3 leads the way in particle-free reactive silver inks, providing the highest conductive performance, sintering efficiency and printing reliability available in the market. C3 has developed the best conducting ink available, and a system of products to use inkjet technology to print F/PCBs.
A nanocomposite dielectric material to serve as (a) insulating layers between the circuits, (b) masking material for soldering, and (c) support at connection points. This material will be develioed to have the following properties: a) high tear and strain resistance, b) compatible with silver ink, c) dielectric constant between 3 to 4, d) good printing performance through a prize inket head, and e) electrical insulating properties. This work is in the development stages already, and will be fully addressed in the proposed project phases I & II. The goal for this Phase I is to develop and produce an ink-jettable metal ink.
The proposed innovation will enable wearable electronics, RFID antennas, satellite communications, navigation and passive detection systems, radio communications, LED lighting systems, temperature sensors, power converters, control tower systems, IOT devices, and other in space applications for NASA. In-space manufacturing market value is expected to reach $7.5 billion by 2030. From 2020- 2030 the market is expected to grow at a CAGR of 17.26%.
B include defense, national security, & supply chain improvements. Lack of a secure domestic supply chain for PCBs poses a national security risk. Additionally, the proposed innovation would enable novel warfighting capabilities and reduce sustainment costs of military weapon systems. Finally, the solution enables.