NASA SBIR 2012 Solicitation

FORM B - PROPOSAL SUMMARY


PROPOSAL NUMBER: 12-2 S1.03-8284
PHASE 1 CONTRACT NUMBER: NNX13CP17P
SUBTOPIC TITLE: Sensor and Detector Technology for Visible, IR, Far IR and Submillimeter
PROPOSAL TITLE: Thermopile Area Array Readout

SMALL BUSINESS CONCERN (Firm Name, Mail Address, City/State/Zip, Phone)
Black Forest Engineering, LLC
9348 Grand Cordera Parkway, Suite 200
Colorado Springs, CO 80924 - 7002
(719) 593-9501

PRINCIPAL INVESTIGATOR/PROJECT MANAGER (Name, E-mail, Mail Address, City/State/Zip, Phone)
Stephen Gaalema
sgaalema@bfe.com
9348 Grand Cordera Parkway, Suite 200
Colorado Springs, CO 80924 - 7002
(719) 593-9501 Extension :100

CORPORATE/BUSINESS OFFICIAL (Name, E-mail, Mail Address, City/State/Zip, Phone)
Erik Gaalema
erikg@bfe.com
9348 Grand Cordera Parkway, Suite 200
Colorado Springs, CO 80924 - 7002
(719) 593-9501 Extension :199

Estimated Technology Readiness Level (TRL) at beginning and end of contract:
Begin: 3
End: 4

Technology Available (TAV) Subtopics
Sensor and Detector Technology for Visible, IR, Far IR and Submillimeter is a Technology Available (TAV) subtopic that includes NASA Intellectual Property (IP). Do you plan to use the NASA IP under the award?
No

TECHNICAL ABSTRACT (Limit 2000 characters, approximately 200 words)
NASA/JPL thermopile detector linear arrays, wire bonded to Black Forest Engineering (BFE) CMOS readout integrated circuits (ROICs), have been utilized in NASA missions such as the Mars Climate Sounder (MCS) and the Diviner Lunar Radiometer Experiment (DLRE). JPL linear array thermopile detectors are fabricated by bulk micro-machining. Micro-machined thermopiles bump bonded to a ROIC are desirable for area (2-D) focal plane arrays (FPAs) because the architecture provides both high detector fill factor and circuit fill factor in the pixel. The proposed innovation is to develop an area array ROIC compatible with bump bondable micro-machined thermopile detectors. The ROIC will be compatible with JPL Bi-Te/Bi-Sb-Te micro-machined thermopile detector arrays to meet requirements of future NASA thermal instruments requiring D-Star > 4 x 109 Jones. Radiation hard-by-design (RHBD) will be utilized with 180 nm CMOS for low 1/f noise readout, operating temp 77-300 K, radiation hardness and noise immunity with on-ROIC ADC. A small pixel pitch and binning is utilized to cover a desired wavelength detection range of 20 �m – 100 μm. The Phase I ROIC array design will be fabricated on Phase II.

POTENTIAL NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
The potential NASA application is a 2-D thermopile FPA radiation hardened to support future missions requiring broadband infrared (BBIR) sensitivity in a TID environment up to 3 MRad. The ROIC demonstrated on Phase II and combined with JPL thermopiles will meet D* = 4x109 Jones. This next-generation thermopile array combined with the BFE ROIC will be the first 2D array designed for a far-IR thermal imager with a grating telescope.

POTENTIAL NON-NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
The 2-D thermopile FPA will support low-cost hand held thermal imager/radiometers for thermography applications, fire-fighting (imaging through smoke) and home security intrusion detection.

TECHNOLOGY TAXONOMY MAPPING (NASA's technology taxonomy has been developed by the SBIR-STTR program to disseminate awareness of proposed and awarded R/R&D in the agency. It is a listing of over 100 technologies, sorted into broad categories, of interest to NASA.)
Circuits (including ICs; for specific applications, see e.g., Communications, Networking & Signal Transport; Control & Monitoring, Sensors)
Detectors (see also Sensors)
Infrared
Long
Optical/Photonic (see also Photonics)
Thermal
Thermal Imaging (see also Testing & Evaluation)

Form Generated on 03-04-14 13:38