| PROPOSAL NUMBER: | 02-II S4.05-7817 (For NASA Use Only - Chron: 024182 ) |
| PHASE-I CONTRACT NUMBER: | NAS3-03053 |
| SUBTOPIC TITLE: | Advanced Miniature and Microelectronics, Nanosensors, and Evolvable Hardware |
| PROPOSAL TITLE: | AlN 3D Thermal Packaging |
SMALL BUSINESS CONCERN:
(Firm Name, Mail Address, City/State/ZIP, Phone)
Technology Assessment & Transfer, Inc.
133 Defense Hwy Suite 212
Annapolis , MD 21401 - 8907
(410 ) 224 - 3710
PRINCIPAL INVESTIGATOR/PROJECT MANAGER:
(Name, E-mail, Mail Address, City/State/ZIP, Phone)
Walter Zimbeck
zimbo@techassess.com
133 Defense Hwy Suite 212
Annapolis , MD 21401 - 8929
(410 ) 224 - 3710
TECHNICAL ABSTRACT (LIMIT 200 WORDS)
The project goal is to demonstrate feasibility of fabricating aluminum nitride (AlN) microelectronic package substrates with integral microchannel heat transfer structure. A novel fabrication approach was demonstrated in Phase I called ceramic stereolithography (CSL), which enables monolithic fabrication of the microchannel AlN substrates. The AlN microchannel devices are suited for cooling high heat flux (10?s to 100?s W/cm2) electronic components in single phase, mechanically pumped thermal control systems. Since the successful demonstration of a single phase, mechanically pumped cooling loop on the Mars Pathfinder Mission, this type of active heat rejection system has become a candidate for future unmanned missions including missions to planets and moons, comets and asteroids, and earth orbiting missions. In comparison to two phase capillary pumped loops and loop heat pipe architectures, the single phase, mechanically pumped loops offer greater simplicity and flexibility in all aspects of the mission life cycle (design, assembly, validation, flight). Future NASA spacecraft will have to manage increasing heat flux densities from electronics, either resulting from spacecraft miniaturization or spacecraft with high power electronic systems. The AlN microchannel substrate approach represents thermal management integrated at the package level and provides a compact, low cost, high heat flux capacity solution.
POTENTIAL NASA COMMERCIAL APPLICATION(S) (LIMIT 150 WORDS)
1) Microspacecraft electronic systems including avionics, tele com, propulsion, science and power.
2) Space-based High Energy Lasers for earth science missions (e.g., CO2, wind shear, ice monitoring)
3) Power conditioning electronics for nuclear electric propulsion craft (e.g., Jupiter Icy Moons Orbiter)
POTENTIAL NON-NASA APPLICATION(S) (LIMIT 150 WORDS)
1) Power conditioning circuits for electric and hybrid electric vehicles.
2) High power land- and sea-based radar such as the Navy?s Advanced Multifunctional RF System
3) Diode Pumped Solid State Lasers and diode laser arrays for a wide variety of applications including industrial, military space and ground, medical and R&D uses.
4) Avionics for commercial and military air- and space-craft